High Density PIR Underfloor Heating Insulation Board Floor Insulation System Solution

Product Overview

The High-Density PIR Underfloor Heating Insulation Board is a high-performance substrate specifically developed for modern underfloor heating systems. Utilizing premium Polyisocyanurate (PIR) as the core material, it is manufactured through precision processes into reinforced panels with a density of ≥45kg/m³. It combines exceptional compressive strength with long-lasting thermal insulation performance. Its unique closed-cell structure not only effectively blocks heat loss to the subfloor, enhancing the thermal efficiency of the heating system, but also provides a solid and level base for the floor finishing, preventing deformation or cracking under long-term load.

Core Advantages

• Exceptional Load-Bearing Capacity
  With a high-density structure (≥45kg/m³) and compressive strength (≥300 kPa), it reliably supports the combined load from heating pipes, concrete screed, and floor finishes, ensuring long-term stability without deformation.

• High Energy Efficiency, Minimal Heat Loss
  The ultra-low thermal conductivity (≤0.023 W/(m·K)) effectively blocks downward heat transfer, concentrating thermal energy within the heated space, significantly improving warm-up times and reducing energy consumption.

• Superior Moisture & Dimensional Stability
  High closed-cell content (≥95%) effectively resists moisture ingress, preventing performance degradation due to dampness. Maintains dimensional stability under temperature fluctuations, avoiding floor loosening from expansion/contraction.

• Environmentally Safe & Easy Installation
  Complies with indoor building material environmental standards, odor-free. Lightweight panels are easy to cut, and tongue-and-groove or butt joint designs enable efficient installation, speeding up construction progress.

Key Performance Parameters

Typical Applications

• Insulation base layer for wet/dry underfloor heating systems in residential and commercial buildings.

• Raised floor insulation requiring high standards of flatness and load-bearing capacity.

• Applications with moisture concerns in low-temperature radiant heating systems (e.g., ground floors, basements).

• Green building projects with high requirements for energy efficiency and living comfort.

Why Choose This Product

1. Professional UFH Solution
   Our product formulation and structure are optimized for the specific needs of underfloor heating, providing a complete solution from substrate insulation to load-bearing support.

2. Durability for System Longevity
   High density and compressive strength ensure the stability of the floor system over the long term, avoiding repair costs due to base layer failure.

3. Comprehensive Heating Efficiency
   Excellent insulation properties can help reduce UFH system energy consumption by up to 30%, shorten pre-heating time, and deliver a more comfortable and economical heating experience.

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High Density PIR Underfloor Heating Insulation Board Floor Insulation System Solution Images